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TMA Measurements
TMA is a highly sensitive method for measuring how the coefficient of thermal expansion changes with temperature. It can also be used to measure volumetric expansion, thermal relaxation, stress relief, and dimensional changes due to phase transitions. Modulated TMA can be used to differentiate between the reversing and non-reversing effects due to temperature.
Typical Experimental Results:
Detection of Indium Melting Point
Thermal expansion of Silicon Nitride.
Applications:
| 3-Point Bending | Compression | Contraction |
| Creep Analysis | Distortion Temperature | Dynamic TMA |
| Expansion | Fiber Testing | Film Penetration |
| Film Tensile Testing | Glass Transition | Isostrain Shrinkage Force |
| Mechanical Characterization | Modulated TMA | Multilayer Film Analysis |
| Softening Point | Stress/Strain Behavior | Stress Relaxation |
| Tension | Thermal Expansion | Viscoelastic Characterization |
For more information please read our application notes.
Instruments: TA Instruments Q400EM Thermomechanical Analyzer
Key Specifications:
| Temperature Range | -150 to 1000°C |
| Temperature Precision | ± 1°C |
| Measurement Precision | ± 0.1% |
| Displacement Resolution | < 0.5 nm |
| Force Range | 0.001 to 2 N |
| Force Resolution | 0.001 N |
| Frequency Range | 0.01 to 2 Hz |
| Atmosphere | Inert, Oxidizing, or Reactive Gases |
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