NanoDMA

The nanoscale dynamic mechanical analysis (nanoDMA) technique is accomplished on a nanoindenter with a dynamic mechanical testing package and heating/cooling stage. It is performed by superimposing a small sinusoidal load on top of a larger quasi-static load during a nanoindentation test. The resultant total indentation displacement into the sample, the dynamic displacement amplitude, and the phase shift from the dynamic load input are recorded and analyzed to yield storage modulus, loss modulus, tangent delta and other mechanical properties and characteristics of the material surfaces.

The nanoDMA technique can be applied for characterizing viscoelastic materials for time dependent properties under controlled temperatures. Typical properties obtained via this powerful technique include complex modulus, storage modulus, loss modulus, tangent delta, frequency dependence, strain rate effect, temperature influence, depth profile, etc.

The new nanoDMA III technology, provided with the Bruker Hysitron TI-980, provides a substantial upgrade over the older technique with the new CMX mode for continuous measurement of a wide range of mechanical properties. Properties such as hardness, loss modulus, tan delta, etc. can be measured as a function of time, frequency, and contact depth. Creep tests can also be performed in which a constant force has a small oscillation superimposed over it. The control software allows tremendous flexibility in adding both quasistatic and dynamic components to the dynamic mechanical test.

Typical Experimental Results

Silicone Rubber 1

Silicon Rubber 2

Polycarbonate

Applications

Instrument: Bruker Hysitron TI-980

Instrument Key Specifications

Instrument: Multi-Technique and Full-Feature Nanoindentation System

Instrument Key Specifications

For more information, please read our application notes:
Temperature Controlled Tensile Testing of Thin Films on a DMA, PDF
All application notes can be found here